KLIC Profile
Kulicke and Soffa Industries, Inc. designs, manufactures, and markets capital equipment and tools essential for assembling semiconductor devices. It operates through two segments: Capital Equipment and Aftermarket Products and Services (APS). The company's product portfolio includes advanced displays, die-transfer, flip-chip, TCB advanced packaging products, ball bonders, die-attach systems, electronics assembly, lithography, wafer-level bonders, and wedge bonders. Additionally, Kulicke and Soffa produces consumables like capillaries, dicing blades, and wedge bonds, along with software solutions for auto offline programming, KNet PLUS, and manufacturing execution systems.
The company also provides comprehensive services, including equipment maintenance, repair, upgrades, and support, ensuring optimal performance and longevity of its products. Kulicke and Soffa's clientele comprises semiconductor device manufacturers, integrated device manufacturers, outsourced semiconductor assembly and test providers, electronics manufacturers, industrial manufacturers, and automotive electronics suppliers. The company's strategic focus is primarily on markets in the United States and the Asia/Pacific region.
Founded in 1951, Kulicke and Soffa has established a strong presence in the semiconductor industry, driven by continuous innovation and a commitment to quality. Headquartered in Singapore, the company leverages its extensive experience and technological expertise to meet the evolving needs of the semiconductor and electronics manufacturing sectors.
In recent years, Kulicke and Soffa has expanded its product offerings and services to address emerging trends in the semiconductor industry, such as advanced packaging and assembly solutions. This strategic expansion positions the company to capitalize on the growing demand for high-performance semiconductor devices across various applications, including consumer electronics, automotive, and industrial sectors.
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